Recent Status of the Stochastic Issues of Photoresist Materials in EUV Lithography

In 2019, finally, extreme ultraviolet (EUV) lithography has been applied to high volume manufacturing (HVM) for preparing advanced semiconductor devices. That was very important year EUV enthusiasts and industry. Because it takes a long time, more than 30 years, study realizing HVM. With recent rapid progress on the source power improvement, development including photoresist materials achieved HVM requirements. However, performance of resist are still not enough expected requirements, even by using latest qualifying materials. One critical issues is stochastic issues, which will be become ‘defectivity’, like nano-bridge or nano-pinching.